U-M Awarded up to $7.5M to Bring Heat-Tolerant Semiconductors From Lab to Fab
Heat-resistant sensing and computing chips made of silicon carbide could advance aircraft, electric and gas-powered vehicles, renewable energy, defense and space exploration—and University of Michigan researchers are leading a multimillion dollar collaborative effort to bring more of them to market.
Funded by the Silicon Crossroads Microelectronics Commons Hub, the project is launching with $2.4 million in initial funding, and could receive up to $7.5 million over three years.